Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications.

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Bibliographic Details
Title:	Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications.
Authors:	Datta, S. K., Tewari, S. N., Gatica, J. E.
Source:	Metallurgical & Materials Transactions. Part A; January 1999, Vol. 30A Issue 1, p175-181, 7p
Database:	Applied Science & Technology Source

Description
ISSN:	10735623
DOI:	10.1007/s11661-999-0205-7