APA (7th ed.) Citation

Datta, S. K., Tewari, S. N., & Gatica, J. E. (1999). Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications. Metallurgical & Materials Transactions. Part A, 30A(1), 175. https://doi.org/10.1007/s11661-999-0205-7

Chicago Style (17th ed.) Citation

Datta, S. K., S. N. Tewari, and J. E. Gatica. "Copper Alloy-impregnated Carbon-carbon Hybrid Composites for Electronic Packaging Applications." Metallurgical & Materials Transactions. Part A 30A, no. 1 (1999): 175. https://doi.org/10.1007/s11661-999-0205-7.

MLA (9th ed.) Citation

Datta, S. K., et al. "Copper Alloy-impregnated Carbon-carbon Hybrid Composites for Electronic Packaging Applications." Metallurgical & Materials Transactions. Part A, vol. 30A, no. 1, 1999, p. 175, https://doi.org/10.1007/s11661-999-0205-7.