Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.

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Bibliographic Details
Title:	Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.
Authors:	Vianco, P. T., Burchett, S. N., Neilsen, M. K.
Source:	Journal of Electronic Materials; November 1999, Vol. 28 Issue 11, p1290-1298, 9p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-999-0170-3