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Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.

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Title: Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.
Authors: Vianco, P. T., Burchett, S. N., Neilsen, M. K.
Source: Journal of Electronic Materials; November 1999, Vol. 28 Issue 11, p1290-1298, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500598057
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.
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  Data: <searchLink fieldCode="AU" term="%22Vianco%2C+P%2E+T%2E%22">Vianco, P. T.</searchLink><br /><searchLink fieldCode="AU" term="%22Burchett%2C+S%2E+N%2E%22">Burchett, S. N.</searchLink><br /><searchLink fieldCode="AU" term="%22Neilsen%2C+M%2E+K%2E%22">Neilsen, M. K.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; November 1999, Vol. 28 Issue 11, p1290-1298, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500598057
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      – Type: doi
        Value: 10.1007/s11664-999-0170-3
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 1290
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      – TitleFull: Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue.
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            NameFull: Vianco, P. T.
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            NameFull: Burchett, S. N.
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            NameFull: Neilsen, M. K.
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            – D: 01
              M: 11
              Text: November 1999
              Type: published
              Y: 1999
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              Value: 11
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