Alloying effects in near-eutectic SnAg-Cu solder alloys for improved microstructural stability.
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| Title: | Alloying effects in near-eutectic SnAg-Cu solder alloys for improved microstructural stability. |
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| Authors: | Anderson, I. E., Foley, J. C., Cook, B. A. |
| Source: | Journal of Electronic Materials; September 2001, Vol. 30 Issue 9, p1050-1059, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-001-0129-5 |
