APA (7th ed.) Citation

Anderson, I. E., Foley, J. C., & Cook, B. A. (2001). Alloying effects in near-eutectic SnAg-Cu solder alloys for improved microstructural stability. Journal of Electronic Materials, 30(9), 1050. https://doi.org/10.1007/s11664-001-0129-5

Chicago Style (17th ed.) Citation

Anderson, I. E., J. C. Foley, and B. A. Cook. "Alloying Effects in Near-eutectic SnAg-Cu Solder Alloys for Improved Microstructural Stability." Journal of Electronic Materials 30, no. 9 (2001): 1050. https://doi.org/10.1007/s11664-001-0129-5.

MLA (9th ed.) Citation

Anderson, I. E., et al. "Alloying Effects in Near-eutectic SnAg-Cu Solder Alloys for Improved Microstructural Stability." Journal of Electronic Materials, vol. 30, no. 9, 2001, p. 1050, https://doi.org/10.1007/s11664-001-0129-5.