Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.

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Bibliographic Details
Title: Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests.
Authors: Cook, B. A., Anderson, I. E., Harringa, J. L.
Source: Journal of Electronic Materials; September 2001, Vol. 30 Issue 9, p1214-1221, 8p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-001-0152-6