Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.

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Bibliographic Details
Title:	Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.
Authors:	Cook, B. A., Anderson, I. E., Harringa, J. L.
Source:	Journal of Electronic Materials; December 2003, Vol. 32 Issue 12, p1384-1391, 8p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-003-0105-3