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Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.

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Title: Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.
Authors: Cook, B. A., Anderson, I. E., Harringa, J. L.
Source: Journal of Electronic Materials; December 2003, Vol. 32 Issue 12, p1384-1391, 8p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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  Data: Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.
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        Value: 10.1007/s11664-003-0105-3
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        Text: English
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      – TitleFull: Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity.
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              Text: December 2003
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