Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying.

Saved in:

Bibliographic Details
Title:	Microstructural Modifications and Properties of Sn-Ag-Cu Solder Joints Induced by Alloying.
Authors:	Anderson, I. E., Cook, B. A., Harringa, J.
Source:	Journal of Electronic Materials; November 2002, Vol. 31 Issue 11, p1166-1174, 9p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-002-0006-x