Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.
Saved in:
| Title: | Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices. |
|---|---|
| Authors: | Yu, Li Ming, Sur, Bang Han, Pyo, Kim Young |
| Source: | Journal of Electronic Packaging; March 2004, Vol. 126 Issue 1, p22-25, 4p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10437398 |
|---|---|
| DOI: | 10.1115/1.1646421 |
