APA (7th ed.) Citation

Yu, L. M., Sur, B. H., & Pyo, K. Y. (2004). Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices. Journal of Electronic Packaging, 126(1), 22. https://doi.org/10.1115/1.1646421

Chicago Style (17th ed.) Citation

Yu, Li Ming, Bang Han Sur, and Kim Young Pyo. "Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices." Journal of Electronic Packaging 126, no. 1 (2004): 22. https://doi.org/10.1115/1.1646421.

MLA (9th ed.) Citation

Yu, Li Ming, et al. "Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices." Journal of Electronic Packaging, vol. 126, no. 1, 2004, p. 22, https://doi.org/10.1115/1.1646421.