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Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.

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Bibliographic Details
Title: Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.
Authors: Yu, Li Ming, Sur, Bang Han, Pyo, Kim Young
Source: Journal of Electronic Packaging; March 2004, Vol. 126 Issue 1, p22-25, 4p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500965971
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.
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  Data: <searchLink fieldCode="AU" term="%22Yu%2C+Li+Ming%22">Yu, Li Ming</searchLink><br /><searchLink fieldCode="AU" term="%22Sur%2C+Bang+Han%22">Sur, Bang Han</searchLink><br /><searchLink fieldCode="AU" term="%22Pyo%2C+Kim+Young%22">Pyo, Kim Young</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>; March 2004, Vol. 126 Issue 1, p22-25, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500965971
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1115/1.1646421
    Languages:
      – Code: eng
        Text: English
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        PageCount: 4
        StartPage: 22
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      – TitleFull: Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices.
        Type: main
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          Name:
            NameFull: Yu, Li Ming
      – PersonEntity:
          Name:
            NameFull: Sur, Bang Han
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            NameFull: Pyo, Kim Young
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            – D: 02
              M: 03
              Text: March 2004
              Type: published
              Y: 2004
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              Value: 126
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            – TitleFull: Journal of Electronic Packaging
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