Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales.

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Bibliographic Details
Title:	Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales.
Authors:	Kerr, M., Chawla, N.
Source:	JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2004, Vol. 56 Issue 6, p50-54, 5p
Database:	Applied Science & Technology Source

Description
ISSN:	10474838
DOI:	10.1007/s11837-004-0112-8