APA (7th ed.) Citation

Kerr, M., & Chawla, N. (2004). Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 56(6), 50. https://doi.org/10.1007/s11837-004-0112-8

Chicago Style (17th ed.) Citation

Kerr, M., and N. Chawla. "Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 56, no. 6 (2004): 50. https://doi.org/10.1007/s11837-004-0112-8.

MLA (9th ed.) Citation

Kerr, M., and N. Chawla. "Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 56, no. 6, 2004, p. 50, https://doi.org/10.1007/s11837-004-0112-8.