Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.

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Bibliographic Details
Title:	Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.
Authors:	Tan, S. T., Chen, B. J., Sun, X. W.
Source:	Journal of Electronic Materials; August 2005, Vol. 34 Issue 8, p1177-1182, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-005-0248-5