APA (7th ed.) Citation

Tan, S. T., Chen, B. J., & Sun, X. W. (2005). Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer. Journal of Electronic Materials, 34(8), 1177. https://doi.org/10.1007/s11664-005-0248-5

Chicago Style (17th ed.) Citation

Tan, S. T., B. J. Chen, and X. W. Sun. "Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer." Journal of Electronic Materials 34, no. 8 (2005): 1177. https://doi.org/10.1007/s11664-005-0248-5.

MLA (9th ed.) Citation

Tan, S. T., et al. "Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer." Journal of Electronic Materials, vol. 34, no. 8, 2005, p. 1177, https://doi.org/10.1007/s11664-005-0248-5.