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Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.

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Title: Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.
Authors: Tan, S. T., Chen, B. J., Sun, X. W.
Source: Journal of Electronic Materials; August 2005, Vol. 34 Issue 8, p1177-1182, 6p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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  Data: Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; August 2005, Vol. 34 Issue 8, p1177-1182, 6p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501117907
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      – Type: doi
        Value: 10.1007/s11664-005-0248-5
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1177
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      – TitleFull: Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.
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            NameFull: Tan, S. T.
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            NameFull: Chen, B. J.
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            NameFull: Sun, X. W.
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              Text: August 2005
              Type: published
              Y: 2005
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