Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer.
Saved in:
| Title: | Cure Shrinkage Measurement of Nonconductive Adhesives by Means of a Thermomechanical Analyzer. |
|---|---|
| Authors: | Tan, S. T., Chen, B. J., Sun, X. W. |
| Source: | Journal of Electronic Materials; August 2005, Vol. 34 Issue 8, p1177-1182, 6p |
| Database: | Applied Science & Technology Source |
Be the first to leave a comment!
