Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process.
Saved in:
| Title: | Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process. |
|---|---|
| Authors: | Rosales-Yeomans, D., Borucki, L., Doi, T. |
| Source: | Journal of the Electrochemical Society; 2006, Vol. 153 Issue 4, pG272-G277, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00134651 |
|---|---|
| DOI: | 10.1149/1.2168392 |
