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Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process.

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Bibliographic Details
Title: Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process.
Authors: Rosales-Yeomans, D., Borucki, L., Doi, T.
Source: Journal of the Electrochemical Society; 2006, Vol. 153 Issue 4, pG272-G277, 6p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501206173
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process.
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  Data: <searchLink fieldCode="AU" term="%22Rosales-Yeomans%2C+D%2E%22">Rosales-Yeomans, D.</searchLink><br /><searchLink fieldCode="AU" term="%22Borucki%2C+L%2E%22">Borucki, L.</searchLink><br /><searchLink fieldCode="AU" term="%22Doi%2C+T%2E%22">Doi, T.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+the+Electrochemical+Society%22">Journal of the Electrochemical Society</searchLink>; 2006, Vol. 153 Issue 4, pG272-G277, 6p
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1149/1.2168392
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      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: G272
    Titles:
      – TitleFull: Implications of Wafer-Size Scale-up on Frictional, Thermal, and Kinetic Attributes of Interlayer Dielectric CMP Process.
        Type: main
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            NameFull: Rosales-Yeomans, D.
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            NameFull: Borucki, L.
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            NameFull: Doi, T.
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            – D: 04
              M: 01
              Text: 2006
              Type: published
              Y: 2006
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              Value: 153
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              Value: 4
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            – TitleFull: Journal of the Electrochemical Society
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