Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
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| Title: | Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. |
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| Authors: | Andry, P. S., Tsang, C. K., Webb, B. C. |
| Source: | IBM Journal of Research & Development; November 2008, Vol. 52 Issue 6, p571-581, 11p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00188646 |
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| DOI: | 10.1147/JRD.2008.5388558 |
