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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.

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Bibliographic Details
Title: Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
Authors: Andry, P. S., Tsang, C. K., Webb, B. C.
Source: IBM Journal of Research & Development; November 2008, Vol. 52 Issue 6, p571-581, 11p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501338047
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
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  Data: <searchLink fieldCode="AU" term="%22Andry%2C+P%2E+S%2E%22">Andry, P. S.</searchLink><br /><searchLink fieldCode="AU" term="%22Tsang%2C+C%2E+K%2E%22">Tsang, C. K.</searchLink><br /><searchLink fieldCode="AU" term="%22Webb%2C+B%2E+C%2E%22">Webb, B. C.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22IBM+Journal+of+Research+%26+Development%22">IBM Journal of Research & Development</searchLink>; November 2008, Vol. 52 Issue 6, p571-581, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501338047
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1147/JRD.2008.5388558
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 571
    Titles:
      – TitleFull: Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
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            NameFull: Andry, P. S.
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            NameFull: Tsang, C. K.
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            NameFull: Webb, B. C.
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              Text: November 2008
              Type: published
              Y: 2008
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              Value: 52
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