Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
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| Title: | Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations. |
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| Authors: | Kumar, Aditya, Yang, Ying, Wong, Chee C. |
| Source: | Journal of Electronic Materials; January 2009, Vol. 38 Issue 1, p78-87, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-008-0565-6 |
