APA (7th ed.) Citation

Kumar, A., Yang, Y., & Wong, C. C. (2009). Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations. Journal of Electronic Materials, 38(1), 78. https://doi.org/10.1007/s11664-008-0565-6

Chicago Style (17th ed.) Citation

Kumar, Aditya, Ying Yang, and Chee C. Wong. "Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations." Journal of Electronic Materials 38, no. 1 (2009): 78. https://doi.org/10.1007/s11664-008-0565-6.

MLA (9th ed.) Citation

Kumar, Aditya, et al. "Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations." Journal of Electronic Materials, vol. 38, no. 1, 2009, p. 78, https://doi.org/10.1007/s11664-008-0565-6.