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Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.

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Title: Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
Authors: Kumar, Aditya, Yang, Ying, Wong, Chee C.
Source: Journal of Electronic Materials; January 2009, Vol. 38 Issue 1, p78-87, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501364795
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PubType: Academic Journal
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  Data: Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; January 2009, Vol. 38 Issue 1, p78-87, 10p
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      – Type: doi
        Value: 10.1007/s11664-008-0565-6
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 78
    Titles:
      – TitleFull: Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations.
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            NameFull: Kumar, Aditya
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            NameFull: Yang, Ying
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            NameFull: Wong, Chee C.
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            – D: 01
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              Text: January 2009
              Type: published
              Y: 2009
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              Value: 38
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