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Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

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Bibliographic Details
Title: Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
Authors: Lai, R. S., Lin, K. L., Salam, B.
Source: Journal of Electronic Materials; January 2009, Vol. 38 Issue 1, p88-92, 5p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-008-0579-0