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Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.

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Title: Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
Authors: Lai, R. S., Lin, K. L., Salam, B.
Source: Journal of Electronic Materials; January 2009, Vol. 38 Issue 1, p88-92, 5p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501364860
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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  Data: <searchLink fieldCode="AU" term="%22Lai%2C+R%2E+S%2E%22">Lai, R. S.</searchLink><br /><searchLink fieldCode="AU" term="%22Lin%2C+K%2E+L%2E%22">Lin, K. L.</searchLink><br /><searchLink fieldCode="AU" term="%22Salam%2C+B%2E%22">Salam, B.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; January 2009, Vol. 38 Issue 1, p88-92, 5p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501364860
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        Value: 10.1007/s11664-008-0579-0
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 88
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      – TitleFull: Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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            NameFull: Lai, R. S.
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            NameFull: Lin, K. L.
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            NameFull: Salam, B.
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            – D: 01
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              Text: January 2009
              Type: published
              Y: 2009
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