Low, C. W., Liu, T. K., & Howe, R. T. (2007). Characterization of Polycrystalline Silicon-Germanium Film Deposition for Modularly Integrated MEMS Applications. Journal of Microelectromechanical Systems, 16(1), 68. https://doi.org/10.1109/JMEMS.2006.886030
Chicago Style (17th ed.) CitationLow, Carrie W., Tsu-Jae King Liu, and Roger T. Howe. "Characterization of Polycrystalline Silicon-Germanium Film Deposition for Modularly Integrated MEMS Applications." Journal of Microelectromechanical Systems 16, no. 1 (2007): 68. https://doi.org/10.1109/JMEMS.2006.886030.
MLA (9th ed.) CitationLow, Carrie W., et al. "Characterization of Polycrystalline Silicon-Germanium Film Deposition for Modularly Integrated MEMS Applications." Journal of Microelectromechanical Systems, vol. 16, no. 1, 2007, p. 68, https://doi.org/10.1109/JMEMS.2006.886030.