Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder.
Saved in:
| Title: | Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder. |
|---|---|
| Authors: | Lin, D. C., Srivatsan, T. S., Wang, G.-X. |
| Source: | Journal of Materials Engineering & Performance; October 2007, Vol. 16 Issue 5, p647-654, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10599495 |
|---|---|
| DOI: | 10.1007/s11665-007-9092-5 |
