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Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder.

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Bibliographic Details
Title: Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder.
Authors: Lin, D. C., Srivatsan, T. S., Wang, G.-X.
Source: Journal of Materials Engineering & Performance; October 2007, Vol. 16 Issue 5, p647-654, 8p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501487227
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder.
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  Data: <searchLink fieldCode="AU" term="%22Lin%2C+D%2E+C%2E%22">Lin, D. C.</searchLink><br /><searchLink fieldCode="AU" term="%22Srivatsan%2C+T%2E+S%2E%22">Srivatsan, T. S.</searchLink><br /><searchLink fieldCode="AU" term="%22Wang%2C+G%2E-X%2E%22">Wang, G.-X.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Engineering+%26+Performance%22">Journal of Materials Engineering & Performance</searchLink>; October 2007, Vol. 16 Issue 5, p647-654, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501487227
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11665-007-9092-5
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      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 8
        StartPage: 647
    Titles:
      – TitleFull: Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder.
        Type: main
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            NameFull: Lin, D. C.
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            NameFull: Srivatsan, T. S.
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            NameFull: Wang, G.-X.
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            – D: 01
              M: 10
              Text: October 2007
              Type: published
              Y: 2007
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              Value: 16
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              Value: 5
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            – TitleFull: Journal of Materials Engineering & Performance
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