Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.

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Bibliographic Details
Title:	Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
Authors:	Tsai, M. Y., Lin, Y. L., Lin, Y. W.
Source:	Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2528-2535, 8p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-010-1376-0