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Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.

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Title: Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
Authors: Tsai, M. Y., Lin, Y. L., Lin, Y. W.
Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2528-2535, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501715056
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Tsai%2C+M%2E+Y%2E%22">Tsai, M. Y.</searchLink><br /><searchLink fieldCode="AU" term="%22Lin%2C+Y%2E+L%2E%22">Lin, Y. L.</searchLink><br /><searchLink fieldCode="AU" term="%22Lin%2C+Y%2E+W%2E%22">Lin, Y. W.</searchLink>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; December 2010, Vol. 39 Issue 12, p2528-2535, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501715056
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-010-1376-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 8
        StartPage: 2528
    Titles:
      – TitleFull: Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Tsai, M. Y.
      – PersonEntity:
          Name:
            NameFull: Lin, Y. L.
      – PersonEntity:
          Name:
            NameFull: Lin, Y. W.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: December 2010
              Type: published
              Y: 2010
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 39
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1