Achieving cost and performance goals using 3D semiconductor packaging.

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Bibliographic Details
Title:	Achieving cost and performance goals using 3D semiconductor packaging.
Authors:	Solberg, Vern¹
Source:	Solid State Technology; Aug/Sep2010, Vol. 53 Issue 8, p24-31, 3p
Database:	Applied Science & Technology Source

Description
ISSN:	0038111X