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Achieving cost and performance goals using 3D semiconductor packaging.

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Bibliographic Details
Title: Achieving cost and performance goals using 3D semiconductor packaging.
Authors: Solberg, Vern1
Source: Solid State Technology; Aug/Sep2010, Vol. 53 Issue 8, p24-31, 3p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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              Text: Aug/Sep2010
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