Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation.
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| Title: | Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation. |
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| Authors: | Romero, Jorge1, jorgerom_met@yahoo.com, Celentano, Diego2, dcelentano@ing.puc.cl, Cruchaga, Marcela3, marcela.cruchaga@usach.cl |
| Source: | Metallurgical & Materials Transactions. Part B; Jun2011, Vol. 42 Issue 3, p612-631, 20p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10735615 |
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| DOI: | 10.1007/s11663-011-9483-8 |
