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Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation.

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Title: Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation.
Authors: Romero, Jorge1, jorgerom_met@yahoo.com, Celentano, Diego2, dcelentano@ing.puc.cl, Cruchaga, Marcela3, marcela.cruchaga@usach.cl
Source: Metallurgical & Materials Transactions. Part B; Jun2011, Vol. 42 Issue 3, p612-631, 20p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 60620275
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation.
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      – Type: doi
        Value: 10.1007/s11663-011-9483-8
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      – Code: eng
        Text: English
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        PageCount: 20
        StartPage: 612
    Titles:
      – TitleFull: Thermal-Microstructural Analysis of Anodic and Electrolytic Copper Solidification: Simulation and Experimental Validation.
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            NameFull: Romero, Jorge
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            NameFull: Celentano, Diego
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            NameFull: Cruchaga, Marcela
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              Text: Jun2011
              Type: published
              Y: 2011
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              Value: 42
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            – TitleFull: Metallurgical & Materials Transactions. Part B
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