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An Integrated Algorithm for 3D-IC TSV Assignment.

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Bibliographic Details
Title: An Integrated Algorithm for 3D-IC TSV Assignment.
Authors: Xiaodong Liu1, Yifan Zhang2, Yeap, Gary3, Xuan Zeng1
Source: DAC: Annual ACM/IEEE Design Automation Conference; Jun2011, p652-657, 6p, 9 Diagrams, 3 Charts
Database: Applied Science & Technology Source
Description
ISSN:0738100X