Interfacial reactions between Sn-57Bi-1Ag solder and electroless Ni-P/immersion Au under solid-state aging.
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| Title: | Interfacial reactions between Sn-57Bi-1Ag solder and electroless Ni-P/immersion Au under solid-state aging. |
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| Authors: | Fuchs, Christopher1, Schreck, Timo1, Kaloudis, Michael1, michael.kaloudis@h-ab.de |
| Source: | Journal of Materials Science; May2012, Vol. 47 Issue 9, p4036-4041, 6p, 4 Diagrams, 3 Graphs |
| Database: | Applied Science & Technology Source |
| ISSN: | 00222461 |
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| DOI: | 10.1007/s10853-012-6257-x |
