Reliability behavior of lead-free solder joints in electronic components.
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| Title: | Reliability behavior of lead-free solder joints in electronic components. |
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| Authors: | Zhang, Liang, zhangliang@nuaa.edu.cn, Han, Ji-guang1, He, Cheng-wen1, Guo, Yong-huan1 |
| Source: | Journal of Materials Science: Materials in Electronics; Jan2013, Vol. 24 Issue 1, p172-190, 19p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-012-0720-y |
