View in EDS PDF Full Text

Reliability behavior of lead-free solder joints in electronic components.

Saved in:
Bibliographic Details
Title: Reliability behavior of lead-free solder joints in electronic components.
Authors: Zhang, Liang, zhangliang@nuaa.edu.cn, Han, Ji-guang1, He, Cheng-wen1, Guo, Yong-huan1
Source: Journal of Materials Science: Materials in Electronics; Jan2013, Vol. 24 Issue 1, p172-190, 19p
Database: Applied Science & Technology Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 84582165
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Reliability behavior of lead-free solder joints in electronic components.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Liang%22">Zhang, Liang</searchLink>, <i>zhangliang@nuaa.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Han%2C+Ji-guang%22">Han, Ji-guang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22He%2C+Cheng-wen%22">He, Cheng-wen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Yong-huan%22">Guo, Yong-huan</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jan2013, Vol. 24 Issue 1, p172-190, 19p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=84582165
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-012-0720-y
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 19
        StartPage: 172
    Titles:
      – TitleFull: Reliability behavior of lead-free solder joints in electronic components.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhang, Liang
      – PersonEntity:
          Name:
            NameFull: Han, Ji-guang
      – PersonEntity:
          Name:
            NameFull: He, Cheng-wen
      – PersonEntity:
          Name:
            NameFull: Guo, Yong-huan
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: Jan2013
              Type: published
              Y: 2013
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 24
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1