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3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.

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Bibliographic Details
Title: 3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.
Authors: Priyabadini, Swarnakamal1, Sterken, Tom1, Van Hoorebeke, Luc2, Vanfleteren, Jan1
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Jul2013, Vol. 3 Issue 7, p1114-1122, 9p
Database: Applied Science & Technology Source
Description
ISSN:21563950
DOI:10.1109/TCPMT.2012.2234830