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3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.

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Title: 3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.
Authors: Priyabadini, Swarnakamal1, Sterken, Tom1, Van Hoorebeke, Luc2, Vanfleteren, Jan1
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Jul2013, Vol. 3 Issue 7, p1114-1122, 9p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 89023223
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1109/TCPMT.2012.2234830
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 1114
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      – TitleFull: 3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology.
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            NameFull: Priyabadini, Swarnakamal
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            NameFull: Sterken, Tom
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            NameFull: Van Hoorebeke, Luc
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              Text: Jul2013
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              Y: 2013
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