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Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity.

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Bibliographic Details
Title: Barrierless Cu–Ni–Nb thin films on silicon with high thermal stability and low electrical resistivity.
Authors: Li, Xiao Na1, Zhao, Li Rong1, Li, Zhen2, Liu, Li Jun1, Bao, Cui Min3, Chu, Jinn P.4, Dong, Chuang1
Source: Journal of Materials Research; Dec2013, Vol. 28 Issue 24, p3367-3373, 7p
Database: Applied Science & Technology Source
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