Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.
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| Title: | Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. |
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| Authors: | Burkhardt, T.1,2 Thomas.Burkhardt@iof.fraunhofer.de, Hornaff, M.1, Acker, A.1, Peschel, T.1, Beckert, E.1, Suphan, K.-H.3, Mensel, K.4, Jirak, S.4, Eberhardt, R.1, Tünnermann, A.1,2 |
| Source: | Journal of Microelectronic & Electronic Packaging. 2012 3rd Quarter, Vol. 9 Issue 3, p113-119. 7p. |
| Database: | Academic Search Ultimate |
| ISSN: | 15514897 |
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| DOI: | 10.4071/imaps.334 |
