APA (7th ed.) Citation

Burkhardt, T., Hornaff, M., Acker, A., Peschel, T., Beckert, E., Suphan, K., . . . Tünnermann, A. (2012). Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. Journal of Microelectronic & Electronic Packaging, 9(3), 113. https://doi.org/10.4071/imaps.334

Chicago Style (17th ed.) Citation

Burkhardt, T., et al. "Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate." Journal of Microelectronic & Electronic Packaging 9, no. 3 (2012): 113. https://doi.org/10.4071/imaps.334.

MLA (9th ed.) Citation

Burkhardt, T., et al. "Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate." Journal of Microelectronic & Electronic Packaging, vol. 9, no. 3, 2012, p. 113, https://doi.org/10.4071/imaps.334.