Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.
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| Title: | Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. |
|---|---|
| Authors: | Burkhardt, T.1,2 Thomas.Burkhardt@iof.fraunhofer.de, Hornaff, M.1, Acker, A.1, Peschel, T.1, Beckert, E.1, Suphan, K.-H.3, Mensel, K.4, Jirak, S.4, Eberhardt, R.1, Tünnermann, A.1,2 |
| Source: | Journal of Microelectronic & Electronic Packaging. 2012 3rd Quarter, Vol. 9 Issue 3, p113-119. 7p. |
| Database: | Academic Search Ultimate |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: asn DbLabel: Academic Search Ultimate An: 123946238 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Burkhardt%2C+T%2E%22">Burkhardt, T.</searchLink><relatesTo>1,2</relatesTo><i> Thomas.Burkhardt@iof.fraunhofer.de</i><br /><searchLink fieldCode="AR" term="%22Hornaff%2C+M%2E%22">Hornaff, M.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Acker%2C+A%2E%22">Acker, A.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Peschel%2C+T%2E%22">Peschel, T.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Beckert%2C+E%2E%22">Beckert, E.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Suphan%2C+K%2E-H%2E%22">Suphan, K.-H.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Mensel%2C+K%2E%22">Mensel, K.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AR" term="%22Jirak%2C+S%2E%22">Jirak, S.</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AR" term="%22Eberhardt%2C+R%2E%22">Eberhardt, R.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Tünnermann%2C+A%2E%22">Tünnermann, A.</searchLink><relatesTo>1,2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2012 3rd Quarter, Vol. 9 Issue 3, p113-119. 7p. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=123946238 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.4071/imaps.334 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 7 StartPage: 113 Titles: – TitleFull: Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Burkhardt, T. – PersonEntity: Name: NameFull: Hornaff, M. – PersonEntity: Name: NameFull: Acker, A. – PersonEntity: Name: NameFull: Peschel, T. – PersonEntity: Name: NameFull: Beckert, E. – PersonEntity: Name: NameFull: Suphan, K.-H. – PersonEntity: Name: NameFull: Mensel, K. – PersonEntity: Name: NameFull: Jirak, S. – PersonEntity: Name: NameFull: Eberhardt, R. – PersonEntity: Name: NameFull: Tünnermann, A. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: 2012 3rd Quarter Type: published Y: 2012 Identifiers: – Type: issn-print Value: 15514897 Numbering: – Type: volume Value: 9 – Type: issue Value: 3 Titles: – TitleFull: Journal of Microelectronic & Electronic Packaging Type: main |
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