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Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics.

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Bibliographic Details
Title: Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics.
Authors: Samavatian, Vahid1, Fotuhi-Firuzabad, Mahmud1, Samavatian, Majid2, Dehghanian, Payman3, Blaabjerg, Frede4 fbl@et.aau.dk
Source: Scientific Reports. 9/9/2020, Vol. 10 Issue 1, pN.PAG-N.PAG. 1p.
Database: Academic Search Ultimate
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ISSN:20452322
DOI:10.1038/s41598-020-71926-7