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Analysis of reliability based on thermal cycle and aging effect in electron devices.

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Bibliographic Details
Title: Analysis of reliability based on thermal cycle and aging effect in electron devices.
Authors: Seetharaman, R1 (AUTHOR) rseetharamanece@annauniv.edu, Anitha, D2 (AUTHOR)
Source: Pramana: Journal of Physics. Jun2021, Vol. 95 Issue 2, p1-5. 5p.
Database: Academic Search Ultimate
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Description
ISSN:03044289
DOI:10.1007/s12043-021-02101-4