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Analysis of reliability based on thermal cycle and aging effect in electron devices.

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Title: Analysis of reliability based on thermal cycle and aging effect in electron devices.
Authors: Seetharaman, R1 (AUTHOR) rseetharamanece@annauniv.edu, Anitha, D2 (AUTHOR)
Source: Pramana: Journal of Physics. Jun2021, Vol. 95 Issue 2, p1-5. 5p.
Database: Academic Search Ultimate
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  Data: Analysis of reliability based on thermal cycle and aging effect in electron devices.
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  Data: <searchLink fieldCode="JN" term="%22Pramana%3A+Journal+of+Physics%22">Pramana: Journal of Physics</searchLink>. Jun2021, Vol. 95 Issue 2, p1-5. 5p.
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        Value: 10.1007/s12043-021-02101-4
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      – Code: eng
        Text: English
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        PageCount: 5
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              Text: Jun2021
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              Y: 2021
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